IBM Japan, Ltd. and Panasonic Corporation’s subsidiary, Panasonic Smart Factory Solutions Co., Ltd. (hereafter “Panasonic”), revealed today that the business have actually concurred to work together to establish and market a brand-new high-value-added system to enhance the general devices efficiency (OEE) of clients’ semiconductor manufacturing processes and to recognize premium manufacturing.
As part of its circuit development procedure service, Panasonic presently establishes and markets edge gadgets and manufacturing techniques that contribute to improving semiconductor manufacturing of innovative product packaging. These brand-new gadgets and techniques consist of dry engraving devices, plasma dicers to produce premium wafers, plasma cleaners that increase metal and resin adhesion and high-accuracy bonding gadgets. This know-how will be integrated with strategies and technology that IBM Japan has actually established for semiconductor manufacturing to aid Panasonic develop clever factory technology. These consist of an information analysis systems consisting of innovative procedure control (APC) and fault detection and category (FDC), in addition to an upper-layer manufacturing execution system (MES) — therefore improving quality and automating production management in semiconductor manufacturing processes.
In current years, IoT and 5G gadgets are ending up being quicker, smaller sized, and more multi-functional. This has actually provided increase to manufacturing that is based upon innovative product packaging technology, in which a middle-end procedure (that integrates the wafer procedure from the front-end procedure and the product packaging technology from the back-end procedure) has actually been included in between the front-end and back-end processes in semiconductor manufacturing.
Through the cooperation revealed today, IBM Japan and Panasonic will collectively establish an information analysis system that will be included into Panasonic’s edge gadgets. The goal of this high-value-added system is to substantially minimize the variety of engineering processes needed, to support item quality, and to enhance the operating rates of manufacturing centers. Particularly, the business mean to establish an automated dish generation system for plasma dicers, which is a brand-new innovative product packaging production technique that is drawing increased attention in the semiconductor manufacturing field, and a procedure control system that integrates an FDC system in plasma cleaners — devices that has actually shown excellent outcomes in the back-end procedure. Moving forward, the brand-new system and IBM Japan’s MES will be linked to enhance OEE factory-wide and to recognize premium manufacturing.
The 2 business mean to establish the brand-new system for the back-end procedure initially, then check out a growth of the scope to the front-end procedure in the future.
Features of the brand-new high-value-added system
1. Advancing plasma dicers through automated dish generation
The computing algorithm collectively established by the 2 business makes it possible for clients to enter their wanted dicing shape (engraving shape), which differs from item to item, and instantly produce devices criteria including numerous hundred mixes. This function is anticipated to substantially minimize item launch times and engineering expenses. It can likewise be used to the APC system, which instantly changes devices criteria according to differing processing quality from front- and back-end processes; which will keep processed shapes steady, resulting in a premium dicing procedure.
2. Advancing plasma cleaners through FDC
FDC constantly collects functional information from running manufacturing devices, identifies failures through its own information analysis technique, and makes it possible for the condition of devices to be analyzed instantly. This function creates devices upkeep target locations and frequency requirements, projections and avoids failures, enhances upkeep scheduling, lowers devices downtime, and enhances operating rates.
IBM has actually been a leader in the IT market for more than 100 years and a leader in the semiconductor field in R&D of innovative miniaturization processing technology — providing strong service outcomes at 300 mm-semiconductor factory throughout the world. In addition, as an options service provider of production operation systems which allow non-stop complete automation at factories, IBM has actually been contributing to the semiconductor manufacturing field for several years. As semiconductors play an essential function in emerging innovations such as IoT and edge-computing, there are growing requirements for higher elegance and miniaturization of semiconductors. Working beyond standard limits, IBM objectives to promote the awareness of clever factories through co-creation with Panasonic, therefore offering brand-new worth to society.
Under its “Gemba Process Innovation” vision, Panasonic is broadening its B2B options service. The gemba, or physical website for frontline operations, refers to all locations where items are made, moved or offered — the locations where worth is produced and issues need to be challenged. By using the business‘s 100-years of experience and know-how got in the manufacturing market with its noticing innovations and edge gadgets, Panasonic objectives to co-create with its clients and partners to resolve issues at the gemba. Panasonic is advancing the Gemba Process Innovation vision, intending to end up being an overall options integrator with offerings to the 3 primary locations of manufacturing, logistics, and retail.
About IBM Japan
For more details on IBM Japan, see https://www.ibm.com/ibm/jp/en/
Panasonic Corporation is an around the world leader in the advancement of varied electronic devices innovations and options for clients in the customer electronic devices, real estate, vehicle, and B2B organisations. The business, which commemorated its 100th anniversary in 2018, has actually broadened worldwide and now runs 582 subsidiaries and 87 associated business worldwide, taping combined net sales of 8.003 trillion yen for the year ended March 31, 2019. Dedicated to pursuing brand-new worth through development throughout divisional lines, the business utilizes its innovations to develop a much better life and a much better world for its clients. To read more about Panasonic: https://www.panasonic.com/global.